On September 27, the Third GMIF2024 Innovation Summit (Global Memory Innovation Forum) has been successfully concluded in Renaissance Shenzhen Bay Hotel. The event was hosted by the Semiconductor Investment Alliance and the Shenzhen Memory Industry Association, co-organized by the Guangdong Integrated Circuit Industry Association and the Shenzhen Semiconductor Industry Association, and organized by JW Insights Consulting (Xiamen) Co., Ltd. and Haitong Securities Co., Ltd.

The summit featured an exhibition area that brought together over 30 participating companies from fields, including memory chips, controller chips, modules, packaging and testing, equipment materials, and SoC platforms, giving a comprehensive display of their latest products and major innovative achievements. The exhibitors,which included both benchmark enterprises in the storage industry and leaders from various segments of the industrial chain, offered a fascinating portrayal of the development achievements, cutting-edge technologies, and industrial trends of the storage industry. The exhibition provided attendees with an opportunity to directly dive deep into the current development state of the industry, in addition to furnishing a platform for enterprises to showcase their achievements and engage in exchange and cooperation.

Below is a list of specific exhibitors:

Solidigm

Based on decades of innovation and rich application experience, Solidigm has been focusing on driving innovation in the solid-state storage field and shaping new paradigms for storage since its establishment in 2021. The company’s diverse product portfolio, including SLC, TLC, and QLC, supports to enhance the performance and energy efficiency of AI storage. Solidigm will continue to work closely with industry partners to provide more efficient, stable, and reliable products and solutions for AI innovation and application.

Solidigm has newly launched two new data center solid-state drives (SSDs), the Solidigm D7-PS1010 and D7-PS1030. These two high-performance innovations, positioned as high-speed PCIe 5.0 SSDs, are currently in mass production, specifically designed for IO intensity demands in modern mainstream, mixed, and write-intensive workloads. The two new SSDs have demonstrated excellent performance at various stages of the AI data pipeline, and are even able to provide up to 50% throughput improvement over similar SSDs in some stages. The Solidigm D7-PS1010 and D7-PS1030 can serve as direct-attached cache drives in GPU servers or support lower-performance HDDs in all-flash high-performance tiers.

Intel (China) Co., Ltd.

Intel (China) Co., Ltd. has demonstrated strong technological leadership through its continuous innovation in semiconductor and computing fields. As a global leader in the technology industry, Intel makes continuous efforts to facilitate the development of computing and storage technologies through endeavors in advanced processor architectures and innovative solutions. The company’s technological breakthroughs in frontier areas such as AI and data centers have brought high-performance and high-reliability product experiences to global customers, further consolidating its leading position in the industry. Intel has set a benchmark for industry development with its excellent technological innovation.

The Intel Core Ultra processor, Intel’s latest achievement in consumer-grade processors, utilizes advanced 3D Foveros packaging and modular design to offer exceptional energy efficiency and AI computing capabilities. The core architecture of this processor includes four functional tiles: a GPU Tile, a CPU Tile, a high-performance and AI computing SoC Tile, and an IO Tile that controls various interfaces

Loongson Technology Co., Ltd.

A leading domestic CPU company in China, Loongson Technology has consistently adhered to independent research and development since its establishment. In 2001, it designed China’s first CPU, Loongson-1, achieving a leap from 0 to 1 in general-purpose processor design for the country. In 2020, the autonomous command system, LoongArch, was launched.

Up to date, Loongson Technology has formulated a product matrix consisting of the Loongson-1 MCU series, Loongson-2 SoC series, and Loongson-3 CPU series, building a comprehensive and diverse range of processor cores and supporting IPs. Taking advantage of its IPO on the Science and Technology Innovation Board (STAR Market) in June 2022, Loongson Technology proposed the “Jianbing” and “Jianke” transformation plans.

In 2023, Loongson Technology further released a new generation quad-core desktop CPU product, the 3A6000, which delivers performance on par with Intel’s 10th generation quad-core products, elevating the design level of general-purpose processors from “catching up” to “keeping pace”.

Silicon Motion Technology Corp.

Silicon Motion, the world’s largest supplier of storage controller chips, has established offices spanning mainland China, Taiwan, Hong Kong, the United States, and other regions. Over its 20 years of establishment, Silicon Motion has committed itself to offering storage solutions for SSDs and other solid-state storage devices, which have been widely used in smartphones, PCs, data centers, commercial and industrial control applications, and more.

At the event, Silicon Motion exhibited a mesmerizing representation of its product series, including the MonTitan™ PCIe Gen5 Enterprise SSD Reference Design Kit, Ferri-eMMC Industrial/Automotive eMMC Memory, SM2508/SM2268XT2 High-Performance Low-Power SSD Controllers, and SM2322 Ultra-High-Speed Portable SSD Controllers.

Among them, the SM2508 is a high-performance, low-power PCIe Gen5 SSD controller solution

designed for AI laptops that require high-capacity, high-performance, and low-power storage solutions.

BIWIN Storage Technology Co., Ltd.

Founded in 2010, BIWIN is committed to becoming a world-class storage and advanced packaging and testing manufacturer with the mission of “Storage Empowers Everything”. Through continuous technological innovation and strong R&D capabilities, the company has successfully established a business model of “Integrated R&D and Packaging and Testing”, demonstrating exceptional competitiveness in research on storage medium characteristics, firmware algorithm development, and packaging and testing technologies. BIWIN has taken proactive measures in the layout of IC design, advanced packaging and testing, and test equipment R&D, aimed at promoting the continuous progress of storage technology, providing efficient and stable storage solutions for the global market, and becoming an important force in leading industry innovation and development.

At the summit, BIWIN showcased its embedded storage, industrial and automotive-grade storage, and enterprise-grade storage solutions. The embedded product series covers UFS, LPDDR, eMMC, ePOP, etc., comprising all sizes, capacities, and protocol interfaces to meet high-performance, low-power consumption, high-reliability, small-size and more high value-added needs of intelligent terminal products in one stop. For the industrial and automotive market, BIWIN has built a product matrix covering solid-state drives, memory modules, embedded chips, and memory cards, covering standard, industrial, and automotive-grade applications. Of these, automotive-grade embedded products reach the standard level of the IATF16949 automotive industry quality management certification system and AEC-Q100 reliability certification, aiming to provide highly reliable, highly secure, and trustworthy storage solutions for various industrial segmented scenarios and intelligent automotive fields. BIWIN has created solid-state drives and memory modules with multiple interfaces, form factors, sizes, and capacities for enterprise-grade data scenarios, and launched CXL memory modules to cope with data-intensive applications such as AI training and inference, helping enterprise users build fast, stable, and cost-effective data infrastructure.

Victory Giant Technology (Huizhou) Co., Ltd.

Victory Giant Technology, as one of the top 100 global PCB manufacturers, has been committed to promoting Chinese “intelligent” manufacturing and advancing technological innovation in the PCB industry. The company adheres to the principles of intelligent manufacturing, green development, and innovation orientation. Underpinned by its excellent product, technology, and service advantages, Victory Giant has realized sustained growth of its business performance. It has now been established as the industry benchmark in the electronic circuit board field, and its high-quality products and services have won wide recognition in the market.

Specifically, it’s a leading maker in high-end graphics cards in the world and has been evaluated as a “Provincial-level Manufacturing Single-Item Champion Enterprise” in Guangdong Province; its process technologies for high-end segmented plug-in boards have granted it the first prize of the Guangdong High-tech Enterprise Association Science and Technology Award. In terms of product and service contribution, as a leader in the PCB industry, Victory Giant was selected as the “2023 Guangdong Famous and High-tech Products” with three products: “5G Base Station RRU Circuit Board,” “Smart Home Control Circuit Board” and “High-end HDI Circuit Board”.

As a full-range PCB product supplier, Victory Giant Technology has the R&D and manufacturing capabilities for 70-layer high-precision circuit boards and 28-layer eight-stage HDI PCBs. At the global forefront of AI computing power and server technology, its high-density multi-layer VGA graphics cards and HD small-pitch LED PCBs hold the largest market share globally. Its products are widely used in new energy, aerospace, automotive electronics, new generation communication technology, big data centers, artificial intelligence, industrial interconnection, medical instruments, and other fields.

Montage Technology Co., Ltd.

Montage Technology, established in 2004, is an international leading data processing and interconnection chip design company dedicated to providing high-performance, low-power chip solutions for cloud computing and artificial intelligence fields. Currently, the company has two major product lines: interconnection chips and Jintide® server platforms, committed to realizing the corporate mission of “making data transmission more efficient and data computing safer” in the digital era.

The CXL memory expansion controller and MRCD/MDB chips were showcased at this exhibition. The CXL memory expansion solution effectively solves the bottlenecks of memory wall and I/O wall by unifying the memory model, ensuring cache coherency, and providing efficient data transfer mechanisms, achieving cost-effectiveness and environmental sustainability at the same time. MRCD and MDB chips are key components applied to MRDIMM memory modules. Each MRDIMM module is typically equipped with one MRCD and ten MDB chips. By adopting double data rate transfer and time-division multiplexing technology, it can operate on two memory arrays simultaneously at standard rates, thus achieving double read and write rates.

InnoGrit Corporation

InnoGrit is a high-tech company focusing on storage technology, dedicated to providing highly stable, reliable, durable, and secure storage products through independent R&D, empowering chip design and system application solutions, significantly improving data storage and transmission efficiency. Its main products include semiconductor ICs, solid-state drives (SSDs), and storage system solutions, which can widely offer solutions for consumer, enterprise, and industrial-grade customers. Application scenarios cover high-performance notebooks, high-end computers, game consoles, data centers, cloud computing, storage systems, industrial control, data acquisition systems, etc., and can radiate to many fields such as finance, telecommunications, transportation, healthcare, education, and public affairs.

At the exhibition, consumer-grade controllers, enterprise-grade controllers, enterprise-grade/data center-grade SSDs, M.2 system disks, and PCIe 3.0 BGA SSDs were displayed.

The company’s products boast leading advantages of high efficiency, low power consumption, and national encryption standards, and are equipped with advanced self-developed 4K LDPC technology to enhance data storage and transmission. InnoGrit provides various flexible business models, including one-stop FTK solutions from SDK to turnkey and reference designs, which can provide complete technical solutions and development support according to needs, meeting customer storage needs in different stages and different application scenarios, as well as reducing overall costs and improving product differentiation competitiveness.

Shenzhen Quanxing Technology Co., Ltd.

Shenzhen Quanxing Technology Co., Ltd. is a semiconductor storage product solution provider integrating R&D, production, and sales. QUANXING, located in Futian, operates an intelligent manufacturing base and international supply chain platform of over 10,000 square meters. With the “QUANXING” brand, it provides integrated services for chip R&D, packaging and testing, module manufacturing, and AI integrated storage and computing solutions. Products cover consumer, industrial, enterprise, automotive-grade and more high-end storage, as well as AI expansion cards and AI training and inference integrated machines. Its AI training and inference integrated machine, featuring a localized deployment solution for LLMs, boasts 70-180B ultra-large models, high precision, and full-parameter fine-tuning, with the entire system priced below one million.

Maxio Technology (Hangzhou) Co., Ltd.

Maxio Technology is a platform-based chip design enterprise providing data storage controller chips and AIoT perception signal processing and transmission chips. Dedicated to independent R&D of core technologies and iterative innovation, it continuously launches large-scale integrated circuit chips with market competitiveness to meet diverse needs, in an effort of providing high-performance solutions for the rapidly developing solid-state drive (SSD) market.

At this exhibition, Maxio presented a full-spectrum display of its new generation product solutions for data centers (such as MAP1803), OEM markets (such as MAP1802), consumer markets (such as MAP1806), embedded storage (such as MAU3202), and other fields, as well as the core competitiveness of the company’s product matrix in high performance, high reliability, high security, low power consumption, and low latency.

With such core competitiveness, Maxio is redefining the way of data storage and access, and is committed to meeting various storage needs across industries and multiple scenarios such as channel markets, gaming, PC OEM, industrial control, and imaging, promoting industry innovation and development with advanced technology.

Powev Electronic Technology Co., Ltd.

As a domestic high-end storage solution provider, POWEV has always been committed to providing customers with high-performance, stable, and high-quality storage products with high cost-performance to help customers cope with market diversification. POWEV’s achievements are not only reflected in technological breakthroughs but also in enhancing the influence of domestic storage brands, leading the trend of the domestic market.

Its own brands include high-end gaming memory Asgard, JD top-selling domestic storage brand GLOWAY, and enterprise-grade storage product SINKER, which are widely used in transportation, industrial automation, 5G, medical care, network security, surveillance, automotive, data centers, consumer electronics, and other fields.

Shenzhen KingSpec Electronics Technology Co., Ltd.

Shenzhen KingSpec Electronics Technology Co., Ltd. has distinguished itself in the industrial control sector with its stable and reliable storage solutions. Underpinned by deep technical expertise and continuous innovation, the company has introduced a range of high-quality storage products capable of withstanding harsh industrial environments. These innovations not only offer high performance and stability but also demonstrate exceptional reliability under extreme conditions, making them widely applicable in fields such as industrial automation and the Internet of Things (IoT), delivering significant value and earning strong market recognition.

Its portfolio includes two self-owned brands: KingSpec consumer-grade storage brand and YANSEN industrial wide-temperature grade storage brand, as well as multiple product lines, including consumer-grade, industrial control grade, industrial grade, enterprise grade, embedded products, etc., which are widely used in industrial automation, rail transit, Internet of Things, security monitoring, medical field, financial field, server field, cloud computing, and other areas.

Silergy Corp.

With commitment to independent innovation, Silergy has established R&D centers in the United States, mainland China, Taiwan, and India, providing customers with the highest quality analog chip solutions and the best technical support. It is also one of the few IDM model manufacturers in the domestic analog chip field, maintaining an annual growth rate of over 30% for more than a decade.

Silergy applies industry-leading process technology to design innovative mixed-signal and analog chips, which are widely used in automotive, industrial, consumer, cloud computing, and communication equipment.

In the past two years, Silergy has launched multiple 32-bit automotive-grade high-performance MCU chips with independent intellectual property rights. Silergy plans to introduce a high-performance ASIL-D MCU based on the RISC-V core, which mainly targets on application scenarios related to the power domain (Traction Inverter/BMS), body domain (ZCU), chassis domain (ONE-BOX/EMB), and ADAS domain. At the event, Silergy also put a spotlight on PMIC solutions such as SY72025 and SY70202, and DDR5 product lines such as SQ40103, providing customers with higher performance and higher reliability analog chip solutions.

Suzhou Maxwell Technologies Co., Ltd.

Maxwell Technologies, a provider of complete process solutions for semiconductor wafer grinding and 2.5D/3D advanced packaging in the post-Moore era, has continually invested in R&D and adhered to independent innovation. In recent years, the company has achieved breakthroughs in high-end equipment and core components for wafer thinning, cutting, and bonding/debonding. To date, Maxwell Technologies has supplied Micro LED laser lift-off and mass transfer equipment to multiple customers, winning the highest market share for these two products in the solid-state laser field.

Maxwell’s latest generation of Micro LED laser lift-off equipment (LLO) and Micro LED mass transfer equipment (LMT) have recently successfully completed sample verification and been delivered to leading companies in the new display field, helping customers better build their Micro LED product lines.

At the exhibition, Maxwell also brought a series of grinding and cutting solutions, including wafer laser process equipment, wafer polishing process equipment, and wafer blade dicing equipment, as well as the bonding solutions, including 12-inch wafer temporary bonding equipment, 12-inch wafer laser debonding equipment, and 12-inch fully automatic fusion bonding equipment.

Suzhou OKN Technology Co., Ltd.

Suzhou OKN Technology Co., Ltd. possesses 13 years of experience in memory test system development, from HDD to SSD, and to NAND chips. Its independently developed test systems provide strong quality assurance for memory products. OKN has R&D capabilities that match international competitors, and to meet enterprise users’ higher requirements for performance and quality, its new generation SSD Gen5 test system and DDR5 test system have surpassed international competitors.

Through continuous innovation in automated test equipment and software development, OKN has significantly improved the testing efficiency and quality control of electronic products, which sets new standards for the industry. At the event, OKN showcased the GA300 series of fully automated integrated SSD testing systems, including desktop testing, high/low temperature testing systems, high-temperature testing systems, as well as the SW400 series of fully automated DIMM testing systems such as SW400_DDR5, SW5600, and the soon-to-be-released SW6400.

Tytantest Co., Ltd.

Tytantest, though just established in 2023, boasts a core team with over 10 years of experience in developing test equipment for leading semiconductor companies. Since its inception, Tytantest has focused on research, innovation, and layout of multiple advanced chip testing equipment fields. By solving major core technical challenges in advanced ATE architecture BI test equipment, such as high-speed communication systems and complex algorithm graphics generation, the company has introduced complete solutions for high-performance, high-integrated, and cost-effective storage BI test equipment to the industry, contributing to breaking through foreign technology bottlenecks.

The company has laid out product series including storage chip ATE testers, BI aging testers, SLT testers, SSD module test equipment, and DDR module test equipment, covering mass production and R&D engineering machines. These innovations help to catalyze the domestic breakthroughs in DRAM and NAND Flash testing equipment, and meanwhile, considerable efforts have been made to conduct in-depth research in semiconductor testing key materials and fixtures to provide customers with comprehensive test equipment delivery and maintenance services.

In response to the testing needs for storage chips and modules, Tytantest has launched China’s first Flash/DRAM BI tester, which features high-concurrency testing, high thermal load, and high-temperature uniformity, and its performance has reached the international first-class level. The industry’s first fully automated SSD production testing equipment, launched by the company, won the FMS2023 Most Innovative Technology Equipment Award. The company also developed and produced China’s first LPDDR5 SLT tester and flash memory tester, achieving domestic breakthroughs while effectively reducing testing costs for customers. Some products have already been mass-produced and delivered to leading domestic IDM manufacturers and design companies.

Dongguan Attach Point Intelligent Equipment Co., Ltd. (APIE)

Dongguan Attach Point Intelligent Equipment Co., Ltd. is headquartered in Dongguan, China, with branches and service facilities in Singapore, the United States, Japan, and Taiwan. The company owns nearly 100 patented technologies and has been recognized as a National High-Tech Enterprise, a Guangdong “Specialized, Refined, Special, New” Enterprise and Innovative Enterprise, and a Standardization-Compliant Enterprise.

Since its establishment, the company has continuously increased investment in underlying common technologies such as motion control, precision machinery, thermoset flow simulation, optical imaging, micro-nano motors, and industrial software. APIE has provided a new generation of semiconductor packaging solutions for semiconductor back-end processes, and its advanced precise packaging die attach/die bonding process has almost achieved full coverage, completing several Chinese firsts: a. China’s first CS packaging COB full-line mass production manufacturer; b. China’s first mass manufacturer of memory multi-layer stacking die bonder; c. China’s first mass producer of general advanced surface mounter MCM.

At the event, APIE showcased its one-stop platform solution for Memory Die Bonders, compatible with three major memory packaging processes. Products include the AP-M200 series ultra-thin chip stacking die bonder, the AP-3500 series general advanced surface mounting solution, and the AP-Smart Inline semiconductor packaging intelligent full-line solution. The company has already shipped over 700+ units of equipment.

Shenyang Heyan Technology Co., Ltd.

Shenyang Heyan Technology Co., Ltd., established in 2011 in Shenyang, Liaoning, had set up sales centers in Nanjing, Suzhou, Nantong, Zibo, Chengdu, Xiamen, Xi’an, Nanchang, and Dongguan. The company mainly produces HG-series wafer grinding machines, DS-series precision dicing machines, JS-series fully automatic integrated cutting and sorting machines, and other semiconductor-specific equipment, focusing on precision grinding and cutting processing of hard and brittle materials such as silicon wafers, glass, ceramics, gallium arsenide, lithium niobate, and metals.

Keeping pace with semiconductor development trends, Heyan Technology has successfully developed the 12-inch fully automatic integrated grinding and polishing machine HG5360, along with its self-developed matching film lamination and delamination machines that can be connected with HG5360, meeting the technical requirements for thinner and more precise chips. These efforts contribute to the development of China’s semiconductor equipment industry, the realization of the domestic production of semiconductor equipment and the breaking of foreign monopolies.

At this event, Heryan also showcased a variety of solutions including the DS630 6-inch automatic dicing equipment, DS9101 8-inch automatic dicing equipment, DS9240 8-inch dual-axis fully automated dicing equipment, DS9260 12-inch dual-axis fully automated dicing equipment, DS9202 12-inch dual-axis automatic dicing equipment, HG5260 12-inch dual-axis fully automated grinding machine, and the JS2800 fully automated cutting and sorting integrated machine. The company is committed to providing customers with integrated R&D, production, sales, and service solutions for semiconductor equipment and supporting process solutions.

Skyverse Technology Co., Ltd.

Skyverse Technology Co., Ltd., established in 2014, is a leading domestic equipment enterprise focusing on high-end semiconductor quality control and now boasts over 1,100 employees. Its headquarters and production base are located in Shenzhen, with branch offices in Beijing, Shanghai, Guangzhou, Suzhou, Xiamen, and Wuhan.

Based on years of deep accumulation and independent innovation in optical detection technology, big data detection algorithms, and automated control software, Skyverse has developed a series of inspection and measurement equipment. These are now widely used in integrated circuit front-end processes and advanced packaging enterprises, which dismantles the long-term dominance of international equipment manufacturers in the quality control equipment field.

Its representative products include: SPRUCE (non-patterned wafer defect inspection equipment), CYPRESSIFM (3D surface profiling metrology equipment), LATIFILM (dielectric film metrology equipment), and ELM (pattern defect inspection 3D AOI equipment).

It’s worth noting that three of its key equipment are anticipated to achieve new progress in the second half of this year. Among them, the bright-field nano-pattern wafer defect inspection equipment has already begun small-batch shipments to leading domestic customers of various types, and the testing feedback from the clients signified that it’s now on smooth operation. Further process testing and verification work will be conducted in the second half of the year. The dark-field nano-pattern wafer defect inspection equipment achieved equipment shipments in the first half of the year, and thanks to long-term technical accumulation and advantages in non-patterned wafer defect inspection equipment, the equipment that the company has shipped was well-established, and it’s expected to embark on a smooth progress during future developments. The optical critical dimension equipment also received good verification results on the client side as its various performance indicators basically satisfied customer requirements, and it’s currently undergoing corresponding testing work for delivery to customers’ mass production departments.

RORZE Createch Co., Ltd.

RORZE Createch Co., Ltd. has demonstrated exceptional innovation and market service in the field of industrial automation equipment. Through continuous breakthroughs in precision control and intelligent manufacturing solutions, the company has significantly improved its clients’ production efficiency and product quality. With robust technical support and strong market responsiveness, RORZE has earned widespread recognition from its customers.

RORZE China factory, completed in October 2022, is located in the Lingang New Area of China (Shanghai) Pilot Free Trade Zone. It has a total construction area of 6,600 square meters, including a 1,800-square-meter standard Class 10,000 clean room and a 2,400-square-meter constant temperature and humidity warehouse. The company is equipped with a comprehensive personnel structure, including R&D staff (mechanical & electrical design engineers), manufacturing staff (assembly & debugging engineers, inspection & systems engineers), and supply chain personnel, capable of meeting domestic customers’ customization needs while strictly adhering to product delivery schedules.

Shenzhen Like Automation Equipment Co., Ltd. (LKAUTO)

Like Automation Equipment specializes in semiconductor and pan-semiconductor packaging and testing process intelligent equipment and solutions, with a particular focus on chip, wafer solder ball mass transfer technology, and fully automatic bagging and boxing lines suitable for packaging forms such as BGA, COB, CSP, and QFN. Its featured products include: LK-AP500 IC Automatic Ball Mounter, LK-WSP1000 WL Wafer Automatic Ball Mounter, and LK-APR300 Automatic Chip Packaging Line.

In particular, the BGA automatic ball mounter from LKAUTO, as the first domestically created equipment of its kind, is designed for CSP/BGA packaged IC chips and mass micro solder ball mounting for precision connectors and plugs. The machine is equipped with key technologies such as gravity-based solder ball grid array (BGA) technology, pin-transfer flux coating technology, and high-negative-pressure massive solder ball transfer technology. It supports a minimum solder ball diameters of 150μm and minimum solder ball pitch of 300μm, achieving mass transfer of up to 80,000 solder balls at once with a production yield of 99.99%. While achieving standardization, modularization, and stable overall operation, it can be customized for specific customer production processes.

With its deep foundation in automation equipment, particularly in the technological innovation of BGA precision ball mounter, LKAUTO has achieved breakthroughs in key equipment, making outstanding contributions to the development of China’s semiconductor packaging industry. Multiple products are market leaders in sales within the country, such as ranking first in domestic BM ball mounting machine sales and first in domestic chip automatic packaging line sales.

Micro-Nano (Hong Kong) Technology Co., Ltd. (MNT)

Micro-Nano (Hong Kong) Technology Co., Ltd., a professional high-tech instrument and equipment supplier, was founded by overseas returnees and acts as an agent for foreign testing equipment. MNT has established cooperative relationships with several universities, dedicated to providing international testing equipment and technical solutions for industries such as materials science, mechanical engineering, semiconductors, medicine, automotive, and aerospace in China.

Anchored in strong sales capabilities and quality service in the semiconductor materials field, MNT is highly acknowledged by Sentronics Metrology GmbH, a Germany semiconductor company, and officially obtained its agency rights on June 1, 2021, mainly responsible for the sales and technical support of Sentronics’ products in China. Sentronics provides unique measurement solution combinations for the semiconductor industry.

At this event, MNT exhibited its key products such as the SemDex M1 semi-automatic system, SemDex A fully automatic system, and a wide range of supporting equipment including SCI infrared asynchronous interference probe, reflective film thickness measurement module (ultra-thin film thickness measurement), white light interferometer (profilometer), and high-resolution camera (lateral dimension measurement). In addition, typical applications highlighted included TSV depth and width measurement, RST and Si thickness measurement, tape/molding layer thickness measurement, bonding wafer thickness measurement, Taiko wafer metrology, Bow/Warp metrology, Die warp (3D NAND wafer post dicing), flatness measurement, Post-Reveal Passivation film measurement, thin film stress measurement, roughness measurement, and 3D profiling measurement.

Hefei Kangxinwei Storage Technology Co., Ltd. (KONSEMI)

KONSEMI, established in November 2018, has Konka Group as its founding stakeholder. The company focuses on the R&D and sales of storage controller chips and storage modules, with products covering consumer, automotive, and industrial control sectors. Its self-developed eMMC products have completed QVL certification with mainstream manufacturers including MediaTek, UNISOC, Amlogic, HiSilicon, Allwinner, Rockchip, and Intel, and are compatible with flash memory from Samsung, Kioxia, Western Digital, Micron, SK Hynix, YMTC, and others. And its products have entered the supply chains of ZTE, Unionman, Hisense, Konka, STAR-NET, Inspur, Baolong, and others, achieving mass production in automotive and industrial control fields. The cumulative sales exceeded 50 million units. KONSEMI’s independently developed UFS storage device is also soon-to-be introduced to the market.

Its eMMC products feature fast read-write speeds and support the current highest HS400 standard, attaining top-tier performance in both speed and subsequent smoothness. It’s also of high reliability for the incorporation of power-off protection and bad block detection algorithms in firmware, which greatly improves product reliability. The product further includes strong error correction capabilities. While most eMMC products in the market adopt the simple but lower-performing BCH algorithm with an error tolerance rate of around 10K/Mbyte, KONSEMI’s LDPC algorithm-based eMMC products achieve industry-leading levels with an error tolerance rate of 50K/Mbyte.

Shenzhen Hemei Jingyi Semiconductor Technology Co., Ltd.

Hemei Jingyi Semiconductor Technology Co., Ltd., founded in 2007 and headquartered in Longgang District, Shenzhen, established production bases in Shenzhen, Jiangmen, and Zhuhai, and a subsidiary in Jiangsu. The company is a high-tech enterprise integrating R&D, production, and sales of IC packaging substrates, as well as a National Specialized, Refined, Special and New “Little Giant” enterprise.

The company’s products cover storage chip packaging substrates, logic chip packaging substrates, and sensor chip packaging substrates. Storage chip packaging substrates encompass both DRAM and NAND Flash domains, capable of mass-producing packaging substrates of mainstream products including LPDDR4/5, DDR3/4/5, EMMC, UFS, EMCP, EPOP, etc. Its product lineup can be widely applied in smart terminals, PCs, big data, IoT, vehicle networking, industrial internet, and other fields.

NAURA Technology Group Co., Ltd.

NAURA Technology Group Co., Ltd. mainly engages in semiconductor equipment, vacuum and lithium battery equipment and precision components businesses, which provide solutions for semiconductors, new energy resources, new materials as well as other related fields. At present, NAURA owns six major R&D and industrial manufacturing bases, and its marketing service system covers the major countries and regions in Europe, America and Asia. With a new futuristic perspective based on technological innovation, NAURA devotes itself to quickening its strategic transformation to become a part of the new-type manufacturing industry, becoming an international leading product service provider in the semiconductor basic products field, improving the smart-living and realizing China’s dream of “strengthening a country through intelligence”.

Its main product portfolio consists of three-dimensional integration & advanced packaging equipment and process solutions, plasma etching machines, microwave plasma surface treatment systems, physical vapor deposition systems, plasma-enhanced atomic layer deposition systems, vertical PI curing oven, single-wafer cleaning equipment, vertical low-temperature annealing furnaces, etc. Recently, the world’s first AMOLED display driver IC with embedded RRAM completed development and certification, and this new breakthrough was technically supported by Hefei Reliance Memory, a memory design company, and fortified by NAURA’s etching and thin film equipment and process solutions.

ACM Research (Shanghai) Inc. (ACMR)

ACMR was officially established in 2005 as a key IC equipment enterprise introduced under Shanghai Municipal Government’s Science and Education Development Project. It’s an integration of the research, development, production, and sale of semiconductor equipment, with a wide product offerings including semiconductor cleaning equipment (single wafer, wet bench, single wafer and bench combination, CO2 supercritical cleaning, edge and backside scrubbing), semiconductor electroplating equipment, vertical furnace tube series equipment (oxidation, diffusion, vacuum annealing, LPCVD, ALD), front-end coating and developing track equipment, plasma-enhanced chemical vapor deposition PECVD equipment, stress-free polishing equipment, advanced post-packaging equipment, and silicon material substrate manufacturing process equipment, dedicated to providing high-end equipment and process solutions for the global integrated circuit industry.

Recently, ACMR launched the new Ultra C bev-p panel edge etching equipment for fan-out panel-level packaging (FOPLP) applications. This equipment is designed for edge etching and cleaning in copper-related processes, capable of simultaneously processing panel front and back edge etching, significantly improving process efficiency and product reliability.

KINGSEMI Co. Ltd.

KINGSEMI Co. Ltd. specializes in semiconductor production equipment R&D and is a leading domestic high-end semiconductor equipment manufacturer. Its products span coaters, developers, spray coaters, strippers, wet etchers, single-wafer cleaners, and other products, forming a complete technical system and rich product series that can be customized according to user process requirements.

Its KS-C300-TB temporary bonding machine excels in supporting and protecting fragile devices such as ultra-thin wafers and pre-thinned wafers during the wafer thinning process in 2.5D/3D high-density packaging. The KS-S300-DBL laser debonding machine is suitable for stress-free separation and cleaning of devices from glass carriers after thinning processes in 2.5D/3D high-density packaging. The KS-S300-E/ST/CL wet stripping etching cleaning machine is designed for metal etching, stripping, lift-off processes, and cleaning processes in RF devices, power devices, optical communication, MEMSLED, and advanced packaging fields. The KS-S300 wafer-level packaging coater/developer is applied for advanced packaging technologies like 2.5/3D, TSV, Flip-Chip, WLCSP, achieving high-viscosity PR.PI coating and various development processes.

Shanghai Micro Electronics Equipment (Group) Co., Ltd. (SMEE)

Shanghai Micro Electronics Equipment (Group) Co., Ltd. (SMEE) is dedicated to the research, design, manufacturing, sales and technical services of semiconductor equipment, pan-semiconductor equipment and high-end intelligent equipment. SMEE is one of the very few manufacturers in China with complete machine integration R&D capabilities of lithography machine and its equipment is widely used in integrated circuit front-end, advanced packaging, FPD panel, MEMS, LED, Power Devices, and other manufacturing fields.

The advanced packaging projection lithography machine exhibited this time is mainly applied in integrated circuit advanced packaging fields, including packaging forms such as Flip Chip, Fan-In, Fan-Out WLP/PLP, and 2.5D/3D advanced, meeting wafer-level/panel-level lithography process requirements for Bumping, RDL, and TSV processes. The SLD series laser annealing equipment is primarily used in power devices (IGBT, MOSFET, HEMT), logic devices (USJ, S/D, silicide), or memory devices (DRAM, FLASH) manufacturing, fulfilling their laser annealing process needs.

ExTripod Electronics Technology Limited

ExTripod Electronics Technology Limited was founded in the year 2011 and focuses on providing integrated solution with worldwide advanced equipment and material for semiconductor packaging. The China Operation Headquarter is located in Suzhou Industrial Park Nano Centre, the nation’s largest nanotechnology application comprehensive community, with branch offices located in Shenzhen, Chengdu, Xi’an and Changsha, covering the entire Chinese market. The company concentrates on advanced packaging, power semiconductors, and compound semiconductors, providing system integration, machine customization, process, and application support for OSAT, IDM, Fabless, and other customers. The company possesses strong technical capabilities as key members boast professional technical backgrounds, rich industry experience, and receive high industry recognition and reputation.

As a transformer of semiconductor packaging technology, ExTripod Electronics achieves various chip heterogeneous composition and interconnection through various packaging technologies, including Wire Bonder, Flip Chip Bonder, TC bonder, Bumping, RDL, etc., to better realize functions such as HPC, AI, 5G, IOT, Storage, etc.

Suzhou iWISEETEC Co., Ltd.

Suzhou iWISEETEC Co., Ltd. has excelled in the semiconductor packaging equipment sector, leveraging its innovative R&D capabilities and efficient equipment solutions to provide reliable packaging support for customers. The company continually enhances the precision and efficiency of its devices to meet diverse packaging requirements. With stable product performance and high-quality service, iWISEETEC has garnered significant recognition from the market and its clients, establishing itself as a key partner in the packaging equipment field.

iWISEETEC pours its efforts into the R&D, production, and sales of semiconductor wafer temporary bonding/debonding/permanent bonding equipment. It now has extensive experience in manufacturing stable 4"/6"/8" fully automatic bonding equipment, which accounts for a 70% of market share. In 2023, the company completed the development of 12" fully automatic bonding equipment, and successfully achieved mass production shipments in the first half of 2024. In the same year, it further accomplished the development of permanent bonding technology equipment. The products exhibited include the ABT-12 fully automatic wafer temporary bonding machine and SPB-08 semi-automatic permanent bonding machine.

Shenzhen Micro Innovation Industry Co., Ltd. (MICROFROM)

Shenzhen Micro Innovation Industry Co., Ltd. is one of the early domestic SSD solid-state drive brands. The group began involvement in the solid-state drive field in 2008, and after 16 years of development, has evolved into a comprehensive enterprise covering packaging, testing, and full industrial chain of SMT. Its current business covers over 20 countries globally, including the United States, Japan, South Korea, France, Singapore, Russia, United Kingdom, Germany, and other developed countries, with branch offices in Japan, South Korea, Hong Kong, Europe, and other locations.

The Group’s brand KingFast channels its energy into industrial control and quasi-industrial control markets, mainly developing product series such as SSDs, memory modules, and TF cards. MICROFROM currently operates a factory of over 5,000 square meters and has approximately 300 employees with most of its R&D personnel from globally renowned enterprises. The group has established a cutting-edge production platform that spans the entire industry chain, from packaging and testing to SMT.

Guangdong EPS Technology Co., Ltd.

Established in 2015, EPS Technology is headquartered in Guangzhou Knowledge City, and additionally sets up production bases of BT substrate material and BF film in Jiangmen. EPS is a specialized enterprise engaged in R&D, production, and sales of semiconductor packaging material. For many years, the company has been dedicated to in-depth research of advanced semiconductor packaging materials, and has accumulated rich R&D and production experience in BT substrate materials and laminated film fields. These efforts are translated into technologically advanced semiconductor substrates and solutions for IC packaging and Mini & Micro LED display industries. After years of persistent efforts, the company now boasts an experienced team of industry professionals and world-class automated production equipment. EPS has become a leading supplier of advanced materials in the Min & Micro LED display substrates and IC packaging fields, including BGA, CSP, FCCSP, and FCBGA.

The EBF laminate film, independently developed by EPS, is a thermosetting film with a low coefficient of thermal expansion and low dielectric loss. Compared to BT substrates, EBF allows for finer circuitry and higher pin count ICs with high transmission, such as CPUs and GPUs. The TPF encapsulation film is a material designed for use in WLP and PLP applications, offering excellent heat resistance and reliable adhesion. It has already been certified and used in small batches by several packaging clients.