The Third GMIF2024 Innovation Summit was successfully held on September 27, 2024 at Renaissance Shenzhen Bay Hotel. The event brought together senior executives and industry experts from renowned domestic and international companies, including the School of Integrated Circuits at Peking University, Micron, Western Digital, Solidigm, Arm, UNISOC, Intel, iFlytek, Rockchip, Silicon Motion, BIWIN, Victory Giant, Allwinner, InnoGrit, Maxio, QUANXING, Montage, Applied Materials (AMAT), Lam Research, DISCO, Skyverse, Loongson Technology, and many others. The gathering saw industry leaders engage in discussions on global storage innovation and ecosystem collaboration for shared growth in the AI era. During the summit, the GMIF2024 Annual Awards were officially unveiled, and a total of 38 key enterprises from across the industry supply chain had been honored for their outstanding contributions.

At the GMIF2024 Innovation Summit, Sam Sun, Chairman of BIWIN Storage, delivered a keynote speech titled “Integrated R&D and Packaging 2.0 Strategy: Full Industry Chain Layout Empowering Client Value Elevation”. In the keynote, Mr. Sun shared BIWIN’s latest strategic initiatives, technological breakthroughs, and future development over the past year. Supported by continued investment and efforts in integrated R&D and packaging and testing, BIWIN Storage is leveraging advanced technology and full-chain collaboration to empower customers to achieve greater value and drive industry progress.

From Brand Upgrade to Global Market Expansion: Innovation-Driven and Sustained Growth

Mr. Sun first and foremost highlighted BIWIN’s significant initiative in brand upgrade in 2024. A new logo and brand slogan were unveiled: ‘Infinite Storage, Unlimited Solutions’. More than a transformation of its brand image, this upgradation is an emblem to BIWIN’s ongoing strategic, technological and market expansion, and the demonstration of its vision to achieve continuous growth in the global storage field as well.

In the global market, BIWIN Storage achieved remarkable results in the first half of 2024, thanks to precise market positioning and efficient localized delivery. Its revenue surpassed 3.4 billion RMB, marking an almost 200% increase year-on-year. This growth reflects the successful implementation of the company’s global expansion and localized operation strategies.

Integrated R&D and Packaging 2.0 Strategy: Building Core Competence to Drive Technological Advancement

BIWIN’s “Integrated R&D and Packaging 2.0 Strategy” is regarded as a crucial initiative in its technological innovation and full-chain layout. Mr. Sun further elucidated BIWIN’s investments in solutions, chip design, packaging and testing, and equipment development, and shared that with concentration on independent R&D and partnerships, BIWIN has now accumulated core strengths in these areas, and been capable of offering customers more high-efficiency and low-power solutions.

BIWIN’s latest strategy not only involves a keen focus on the R&D and packaging and testing of mainstream memory, but shifts attention to more far-reaching development opportunities in high-end advanced packaging and testing technology. Powered by its dual-drive strategy, BIWIN is dedicated to further enhancing its competitiveness in the storage industry, and providing customers with innovative and cost-effective solutions.

The Third GMIF2024 Innovation Summit

Strategic Advanced Packaging and Testing Layout: Overcoming Industry Bottlenecks to Secure Future Advantages

In the face of the increasing technological demands and market challenges in the storage industry, BIWIN Storage is actively promoting its full-chain layout. Mr. Sun noted that, in addition to focusing on storage solution R&D, the company has also been a pioneer in establishing storage packaging capabilities in South China. By advancing its wafer-level packaging and testing layout, BIWIN has positioned itself as one of the few semiconductor storage companies capable of offering advanced packaging services.

With the adoption of cutting-edge technologies such as 3D/2.5D packaging, BIWIN Storage is able to deliver top-notch services to customers in reducing product power consumption, improving performance, and offering customized packaging and testing services for areas such as computing power. Mr. Sun emphasized that advanced packaging and testing is not only the consequence driven by market demand but is also the inevitable direction of future industry development. This layout will further solidify BIWIN Storage’s leadership in the storage industry.

Intensifying Efforts in the Greater Bay Area: Creating a Holistic Industry Chain Ecosystem to Empower Regional Innovation

To accelerate the implementation of advanced packaging and testing, BIWIN Storage has chosen to establish an advanced packaging and testing factory in the Greater Bay Area. As a core hub of China’s high-tech industry, the Greater Bay Area houses numerous IC design companies and innovative enterprises. However, there are still significant gaps in the packaging and testing field. BIWIN’s advanced packaging and testing layout fills this gap and promotes the coordinated development of the entire industry chain.

Mr. Sun expressed that BIWIN Storage plans to launch its new plant in 2025 to provide more efficient and flexible packaging and testing services for customers in areas such as computing power. This layout will not only strengthen the company’s competitiveness in the storage market but also inject new vitality into the Greater Bay Area’s innovation ecosystem.

Integrated R&D and Packaging 2.0 Strategy: Building Core Advantages to Strengthen Customer Loyalty

In the summary of the “Integrated R&D and Packaging 2.0 Strategy”, Sam Sun emphasized that the core of this strategy lies in enhancing BIWIN’s core competitiveness in the storage industry through technological innovation and full-chain collaboration, while establishing closer partnerships with clients. The main advantages of this strategy are reflected in the following four aspects:

01 Expanding Industry Coverage

The Strategy contributes to enhancing collaboration with upstream wafer fabs to maintain control over R&D, manufacturing, and mass production, while serving a wider range of customers and expanding the industry chain through the application of advanced packaging and testing technologies.

02 Enhancing Technological Barriers

The Strategy contributes to strengthening technological innovation by increasing R&D investment, and participating in more high-end application scenarios, so as to gain a unique market advantage and secure a technological edge in the competitive landscape.

03 Driving Innovation and Differentiation

The Strategy contributes to offering products with higher bandwidth, lower power consumption to the market by developing differentiated solutions, more complex packaging processes, and advanced memory architectures, showcasing BIWIN’s technological strength in the industry.

04 Strengthening Customer Loyalty and Trust

The Strategy contributes to providing high-quality and customized solutions, along with comprehensive technical and service support, to strengthen customer relationships and trust and achieve mutual success through deep collaboration with customers.

Looking Ahead: Focusing on Dual-Drive Strategy to Elevate Customer Value

He Han, GM/CEO of BIWIN, received the GMIF2024 “Outstanding Industry Innovation Award”

In the end, Mr. Sun concluded BIWIN Storage’s vision with the phrase “BIWIN, WIN-WIN”. He emphasized that BIWIN Storage will continue its dual-drive strategy of storage and advanced packaging and testing to join hands with customers to seize future opportunities in the storage industry. BIWIN Storage aims to be more than just a storage product provider — it strives to be a trusted all-around partner, driving technological innovation and commercial success together with its customers.